Waterless two-phase direct-to-chip liquid cooling for AI and HPC servers
ZutaCore builds waterless, two-phase direct-to-chip cooling for dense AI and HPC racks. Its stack pairs heavy thermal simulation tooling (ANSYS Fluent, STAR-CCM+, Flotherm, MATLAB) with server OEM platforms like Dell, HPE, Supermicro and NVIDIA, pointing to deep design-in work with hardware partners. Engineering-heavy, senior-skewed hiring in the US and Israel, plus projects on contract-manufacturer transfer, signals a push from R&D into volume production.
ZutaCore is a privately held hardware company founded in 2016 and headquartered in San Jose, California, with 51–200 employees. It develops direct-to-chip liquid cooling that uses a dielectric fluid boiling into vapor at the processor, avoiding water in the server. The technology targets data center operators running AI and HPC workloads, including hyperscale, colocation and edge deployments, with goals of higher rack density and lower energy use. Commercial operations run on Salesforce, HubSpot and NetSuite, while product design relies on SolidWorks, Creo and NX.
ZutaCore uses ANSYS Fluent, STAR-CCM+, Flotherm and MATLAB for thermal simulation, SolidWorks, Creo and NX for CAD, plus Salesforce, HubSpot, NetSuite, Python, Java and AWS, Azure and GCP.
ZutaCore is headquartered in San Jose, California, and hires in both the United States and Israel.
Current projects include an AI silicon thermal integration roadmap, in-package cooling integration, design-in of its solutions for next-generation AI systems, and transferring products to contract manufacturers.
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ZutaCore's technology stack, projects, and hiring signals are inferred from public hiring and company data — career pages, public listings, and company web presence — then clustered and de-duplicated. Figures are estimates that refresh over time. Read our full methodology →
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