Defense and space imaging sensors, infrared detectors, and compound semiconductors
Teledyne Scientific & Imaging operates as Teledyne's central R&D lab, converting government-funded research into production semiconductor and imaging products. The engineering-heavy hiring profile (17 open roles) paired with manufacturing (11 roles) and a pain-point list dominated by yield, throughput, and cycle-time reduction signals an organization scaling production capacity while managing the yield complexity inherent in infrared focal-plane-array and compound-semiconductor fabrication.
Teledyne Scientific & Imaging comprises two business units: Teledyne Scientific Company, which transitions government-funded contract R&D into commercial Teledyne products, and Teledyne Imaging Sensors (including Teledyne Judson Technologies), which manufactures imaging systems for military, space, astronomy, and commercial markets. The company specializes in high-performance compound semiconductors, infrared and visible sensors, read-out integrated circuits (ROICs), infrared focal-plane arrays, scientific and tactical cameras, and laser protection devices. Based in Thousand Oaks, CA, the organization operates across 201–500 employees, with active projects spanning wafer fabrication, detector-array development, and device modeling alongside environmental and safety compliance programs.
Core tools include Python, C/C++, MATLAB, AutoCAD, and Spotfire for simulation and analysis. Manufacturing and fabrication rely on FPGA, GPU, Docker, CMake, Linux, and ERP systems. Microsoft Office and project-management tools support operations.
Active projects focus on infrared and visible focal-plane-array development, semiconductor detector fabrication, HgCdTe wafer growth, ROIC-based product validation, and process improvement across wafer fabrication and yield enhancement.
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