Laser-based wafer manufacturing equipment for semiconductor fabrication
Halo Industries builds laser-based wafer processing systems aimed at replacing legacy semiconductor slicing methods. The stack pairs Beckhoff TwinCAT 3, EtherCAT, OPC UA and Cognex VisionPro with Altium, SolidWorks and Arena PLM, the toolset of a capital-equipment maker. Accelerating, senior-heavy engineering hiring and repeated pain points around pilot and production scale-up show a company moving from R&D prototypes into manufacturing.
Halo Industries develops laser-based hardware systems for materials fabrication, focused on wafer manufacturing for the semiconductor industry. Its equipment is intended to help manufacturers cut waste and improve quality. Founded in 2014 and headquartered in Santa Clara, California, the privately held company employs 51–200 people. Hiring is concentrated in the United States, primarily in engineering, with smaller operations and research functions.
Halo Industries designs laser-based wafer manufacturing systems and semiconductor capital equipment, including high-precision electro-mechanical tools for wafer processing.
Halo uses Beckhoff TwinCAT 3, EtherCAT, OPC UA, LabVIEW, MATLAB, Python, C++, C#/.NET, SolidWorks, Altium Designer, Arena PLM, NetSuite, Jira and Confluence.
Yes. Hiring is accelerating and centered on engineering, skewed toward senior and staff-level roles, with all positions based in the United States.
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Halo Industries, Inc.'s technology stack, projects, and hiring signals are inferred from public hiring and company data — career pages, public listings, and company web presence — then clustered and de-duplicated. Figures are estimates that refresh over time. Read our full methodology →
This is not an official vendor or customer list. It is a technology-adoption signal inferred from public data, intended for B2B research.