SerDes and chiplet interconnect IP for next-generation SoCs
EXTOLL designs high-speed, low-power semiconductor IP for chiplet and system-on-chip architectures. The stack—Cadence, Virtuoso, Spectre, SystemVerilog, Xcelium, UVM—reflects a signals-and-power-focused hardware design practice. Active hiring is concentrated in senior and principal-level engineering roles across Germany and Austria, with 5 of 9 open positions posted in the last 30 days, suggesting pressure to scale verification and physical design capabilities as the company tackles multi-node porting and methodology improvements.
EXTOLL develops semiconductor intellectual property (IP) for die-to-die interfaces, networks-on-chip (NoC), and chiplet connectivity, targeting ASIC and SoC manufacturers. Founded in 2011 and based in Mannheim, the company specializes in ultra-low-power, high-speed serializer-deserializer (SerDes) technology optimized for smallest footprint and best power-performance-area (PPA) metrics. Current work spans NoC IP verification environments, RTL-to-GDS implementation, and physical design validation across multiple technology nodes. The company operates as a privately held design house serving the global semiconductor supply chain.
EXTOLL develops high-speed, low-power SerDes, Networks-on-Chip (NoC), and die-to-die interface IP for next-generation SoCs and chiplet architectures, optimized for minimal power and area footprint.
The company's stack includes Cadence Virtuoso, Spectre, Xcelium simulation, SystemVerilog, UVM, and TCL scripting for IP design, verification, and physical implementation workflows.
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