Semiconductor and infrastructure software for networking, connectivity, and cloud platforms
Broadcom manufactures semiconductors across networking, wireless, storage, and broadband markets, alongside a growing infrastructure software portfolio (VMware stack). The hiring mix is heavily skewed toward engineering (70% of active roles), with projects focused on advanced packaging, RoCE firmware, and DFT automation — pointing to sustained investment in next-gen chip design and manufacturing yield. Adoption of VMware Cloud Foundation and Kubernetes signals internal infrastructure consolidation across an organization managing both silicon fabrication and software at scale.
Notable leadership hires: Account Director, ASIC Chip Lead
Broadcom is a public semiconductor manufacturer and infrastructure software provider serving enterprise and service-provider customers globally. The semiconductor business spans connectivity (networking, wireless), compute (servers, storage), broadband, and industrial markets, built on decades of R&D in signal processing and protocol implementation. The infrastructure software division, rooted in VMware technologies, addresses private cloud, mainframe software, cybersecurity, and Fibre Channel SAN management. With 10,000+ employees across design, manufacturing, and software engineering, Broadcom operates fabrication partnerships (notably TSMC) alongside internal design teams spanning Verilog, SystemVerilog, C++, and Go.
Hardware design: Verilog, SystemVerilog, UART, I2C, RDMA, ARM64, x86. Infrastructure: VMware (vSphere, NSX, vSAN, vCenter), Kubernetes, Docker. Automation: Terraform, Ansible, Helm. Languages: C++, Java, Python, Go. Monitoring: Prometheus, Grafana.
RoCE firmware and driver development, advanced chip packaging (2.5D/3D interconnects), design-for-test automation at 7nm+, yield improvement initiatives, and VMware Cloud Foundation adoption and feature development.
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