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Accelsius Tech Stack
Direct-to-chip liquid cooling for AI and HPC datacenters
Accelsius manufactures two-phase direct-to-chip liquid cooling systems for high-density computing. The stack reveals deep hardware engineering expertise: Altium and SolidWorks for design, C/C++ and Embedded Linux for firmware, OpenBMC for baseboard management, and thermal simulation tools (Yocto, Bitbake) for validation. The hiring mix is engineering-dominant (9 of 11 roles), weighted toward senior and manager levels, suggesting focus on accelerating product development and early-stage deployments rather than scaling sales.
Tech Stack 15 technologies
Core StackSolidWorks NetSuite Altium C/C++ Embedded Linux OpenBMC Bitbake Yocto Redfish IPMI Modbus Minitab Microsoft Office
AdoptingISO 14001 ISO 45001
What Accelsius Is Building
◆Challenges
- Heat management in data centers
- Excessive heat in data centers
- Traditional cooling system limitations
- Developing advanced two-phase cooling products
- Traditional cooling systems struggle to manage heat
- Inefficient traditional cooling
- Implementing iqms system
- Improving incoming inspection
- Traditional cooling systems inadequate
- High-density computing environments
▲Active Projects
- Enterprise cooling platform electronics
- High-power thermal simulation sled
- Sensor integration for control loops
- Two-phase cooling product development
- Prototype development and system builds
- Rack-level system integration during early deployments
- Evaporator plate design for 2-phase cooling
- Cold plate design for modern processors/gpus
- Embedded software for enterprise cooling solutions
- Openbmc based software stack development
Hiring Activity
10 roles · 3 in 30d
Department
Seniority
Company intelligence
