Specialty IC foundry operating five 8-inch fabs across Taiwan and Singapore
VIS is a public specialty IC foundry with ~282,000 wafers/month capacity across five 8-inch facilities. The hiring mix—64 engineering roles against 21 manufacturing—reflects active fab expansion: projects span new equipment startup, tool qualification, and CIP optimization, while pain points cluster around yield, uptime, and scrap reduction. A 2024 joint venture with NXP (VSMC) adds a 12-inch fab capacity launching in 2027, signaling a shift toward higher-density process nodes.
VIS operates as Taiwan's specialty IC foundry, focusing on high-voltage, analog, mixed-signal, and embedded-memory process technologies for industrial and automotive customers. The company runs five 8-inch fabs in Taiwan and Singapore with approximately 282,000 wafers of monthly capacity as of 2024. Recent projects center on equipment modernization, new product qualification, and manufacturing optimization—typical of a fab scaling into more advanced nodes. In 2024, VIS and NXP established VSMC, a Singapore-based joint venture whose 12-inch fab is planned to begin production in 2027, expanding the company's technology roadmap beyond its existing 8-inch footprint.
VIS operates five 8-inch fabs in Taiwan and Singapore with approximately 282,000 wafers of monthly capacity as of 2024. A joint venture 12-inch fab with NXP is scheduled to begin production in 2027.
VIS offers High Voltage, Ultra High Voltage, Bipolar CMOS DMOS (BCD), Silicon on Insulator (SOI), Discrete, Logic, Mixed-Signal, Analog, High Precision Analog, Embedded Memory, and MEMS process technologies.
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