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Vanguard International Semiconductor Corporation (VIS) Tech Stack

Specialty IC foundry operating five 8-inch fabs across Taiwan and Singapore

Semiconductor Manufacturing Hsinchu 5,001–10,000 employees Founded 1994 Public Company

VIS is a public specialty IC foundry with ~282,000 wafers/month capacity across five 8-inch facilities. The hiring mix—64 engineering roles against 21 manufacturing—reflects active fab expansion: projects span new equipment startup, tool qualification, and CIP optimization, while pain points cluster around yield, uptime, and scrap reduction. A 2024 joint venture with NXP (VSMC) adds a 12-inch fab capacity launching in 2027, signaling a shift toward higher-density process nodes.

Tech Stack 73 technologies

Core StackC++ C# Java Python VMware Hyper-V Linux Active Directory Cisco Power BI SAP Oracle QuickBooks C Windows DNS DHCP Word Excel PowerPoint Puppet Development Kit VBA Microsoft Office MEMS SPC Oracle SQL HTML5 AWS ECS APC Microsoft Project+42 more

What Vanguard International Semiconductor Corporation (VIS) Is Building

Challenges

  • Yield improvement
  • Reducing maintenance costs
  • Minimizing downtime
  • Reducing wafer scrap
  • Optimizing preventive maintenance
  • Improving equipment uptime
  • Reducing equipment downtime
  • Productivity enhancement
  • Substation equipment maintenance
  • Wafer return failure analysis

Active Projects

  • New equipment start-up coordination
  • Cip program optimization
  • Equipment improvement projects
  • Defect source library development
  • New product introductions
  • Module cit program
  • Cleanroom tool hook-up
  • Upgrading and expansion projects
  • New products qualification
  • System enhancement

Hiring Activity

Steady110 roles · 40 in 30d

Department

Engineering
64
Manufacturing
21
HR
4
Ops
4
Finance
3
Support
3
Legal
1
Marketing
1

Seniority

Senior
52
Mid
23
Junior
12
Manager
9
Intern
3
Lead
2
Principal
2
Director
1
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About Vanguard International Semiconductor Corporation (VIS)

VIS operates as Taiwan's specialty IC foundry, focusing on high-voltage, analog, mixed-signal, and embedded-memory process technologies for industrial and automotive customers. The company runs five 8-inch fabs in Taiwan and Singapore with approximately 282,000 wafers of monthly capacity as of 2024. Recent projects center on equipment modernization, new product qualification, and manufacturing optimization—typical of a fab scaling into more advanced nodes. In 2024, VIS and NXP established VSMC, a Singapore-based joint venture whose 12-inch fab is planned to begin production in 2027, expanding the company's technology roadmap beyond its existing 8-inch footprint.

HeadquartersHsinchu
Company Size5,001–10,000 employees
Founded1994
Hiring MarketsSingapore, United States, Taiwan

Frequently Asked Questions

What is VIS's current manufacturing capacity?

VIS operates five 8-inch fabs in Taiwan and Singapore with approximately 282,000 wafers of monthly capacity as of 2024. A joint venture 12-inch fab with NXP is scheduled to begin production in 2027.

What process technologies does VIS offer?

VIS offers High Voltage, Ultra High Voltage, Bipolar CMOS DMOS (BCD), Silicon on Insulator (SOI), Discrete, Logic, Mixed-Signal, Analog, High Precision Analog, Embedded Memory, and MEMS process technologies.

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