Teledyne FLIR Tech Stack
Thermal imaging and sensing systems for defense, industrial, and commercial markets
Teledyne FLIR manufactures thermal and optical imaging systems across defense, industrial, and commercial applications. The tech stack reveals a hardware-centric organization anchored in embedded systems (C++, CUDA, NVIDIA Orin, Xilinx) paired with a heavy SAP ERP footprint—a pattern typical of large-scale discrete manufacturers. Active hiring concentrates in engineering (31 roles) with senior-level dominance, while pain points center on SAP integration stability and manufacturing process optimization, suggesting the company is modernizing both product capabilities (machine vision, robotics, deep learning) and operational infrastructure.
Tech Stack 70 technologies
What Teledyne FLIR Is Building
◆Challenges
- Ensuring long-term viability of sap solutions
- Monitoring and self-service for sap integration landscape
- Inventory reduction
- Production impediments
- Avoiding unauthorized transfers
- Maintaining legacy sap integrations
- Resolving integration interface issues
- Long-term viability of sap integrations
- Improving manufacturing processes
- Maintaining compliance records
▲Active Projects
- Mature machine learning stack development
- Monitoring and self-service platform for sap integration landscape
- Next generation thermal imaging products
- Implement newest techniques in machine vision, robotics, and deep learning
- Commodity jurisdiction determination submission
- Robotics and machine learning project
- Lean manufacturing initiatives
- Jc process development and training
- Anaplan model development for finance, engineering, and it
- Dod compliant technical documentation
Hiring Activity
Department
Seniority
Notable leadership hires: Business Excellence Director
