Black Semiconductor Tech Stack
Graphene-based chip interconnect platform scaling toward production
Black Semiconductor manufactures photonics-integrated semiconductor chips using graphene as the substrate material. The company is in active fab buildout phase — equipment installation, cleanroom infrastructure, and process qualification dominate their project list — while hiring heavily across engineering and manufacturing roles, with a notable seniority skew toward senior and manager-level positions. Pain points cluster around yield optimization, CMP (chemical-mechanical polishing) process development for 2D materials, and lithography stabilization, which aligns with a company transitioning from R&D into production-scale manufacturing.
Tech Stack 25 technologies
What Black Semiconductor Is Building
◆Challenges
- Improving yield
- Optimizing cmp equipment
- Ensuring uptime
- Tool installation and qualification
- Building new semiconductor fab
- Initial fab buildout
- Developing cmp processes for 2d materials
- Stabilizing lithography processes
- Expanding semiconductor fab infrastructure
- High-performance plating capabilities
▲Active Projects
- Equipment installation and process qualification
- Black fabone semiconductor fabrication facility buildout
- Cleanroom and sub-fab infrastructure projects
- Tool planning and installation for black fabone
- Continuous improvement (cip) plans
- Advancing wet cleaning capabilities
- Advanced plating processes for 2d materials
- Preventive and predictive maintenance programs
- Laboratory testing of critical parameters and documentation
- Implementing new fabone data center
Hiring Activity
Department
Seniority
Notable leadership hires: Device Characterization Lead
