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深圳福能达空气与水科技发展有限公司 Tech Stack

Embedded systems and thermal-management hardware design

Retail 深圳市, 广东省 ~13 employees

福能达 designs embedded control systems and thermal hardware—refrigeration units and heat exchangers—using microcontroller stacks (STM32, STM8) paired with CAD tools (Solidworks, Creo, Altium Designer). The company is engineering-heavy with minimal recent hiring activity, suggesting a mature product cycle focused on incremental improvement rather than expansion.

Tech Stack 14 technologies

Core StackAutoCAD Solidworks SolidWorks STM32 STM8 I2C RS-232 RS485 C Keil Altium Designer Creo UG NX CAD

What 深圳福能达空气与水科技发展有限公司 Is Building

Challenges

  • Improve energy efficiency
  • Reduce cost
  • Functional improvement

Active Projects

  • Refrigeration system development plan
  • Heat exchanger design
  • Control logic output

Hiring Activity

Minimal6 roles · 0 in 30d

Department

Engineering
4
Executive
1
Sales
1

Seniority

Senior
4
Junior
1
Manager
1
Company intelligence

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About 深圳福能达空气与水科技发展有限公司

福能达 is a hardware and embedded-systems company based in Shenzhen, China. The product focus spans refrigeration system design, heat-exchanger engineering, and embedded control logic. The tech stack reflects classical industrial-electronics work: low-level microcontroller programming (C on STM32/STM8), PCB design (Altium), and mechanical CAD (Solidworks, Creo, UG NX). The organization is small and engineering-centric, with active R&D on energy efficiency and cost reduction.

Headquarters深圳市, 广东省
Company Size~13 employees
Hiring MarketsChina

Frequently Asked Questions

What microcontrollers does 福能达 use?

STM32 and STM8 are core to their embedded stack, programmed in C using Keil as the development environment. I2C and RS-232/RS485 handle communication protocols.

What CAD tools does 福能达 use for hardware design?

Altium Designer for PCB layout; Solidworks, Creo, and UG NX for mechanical design. AutoCAD is also in the stack.

What is 福能达 currently working on?

Three active projects: refrigeration system development, heat exchanger design, and embedded control logic optimization. Internal focus includes energy efficiency improvement and cost reduction.

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