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UNISOC designs application processors and connectivity chips for smartphones, IoT devices, smart displays, and automotive systems across 500+ OEM customers worldwide. The hiring surge—287 roles posted in the last 30 days, 373 engineers on staff—reflects aggressive scaling in chip bringup testing, DFT design, and RF transceiver modules, even as yield improvement and power consumption remain operational friction points.
Tech Stack 200 technologies
Core StackLinux Python Java C++ MATLAB Android RTOS C 5G LTE ASIC Verilog FPGA AXI Cadence Virtuoso Spectre HSPICE 5G NR WiFi 6 Bluetooth Mixer USB LPDDR SystemVerilog UVM Perl Cadence WiFi GNSS 4G+170 more
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What UNISOC Is Building
◆Challenges
- Yield improvement
- Enhance product competitiveness
- Improving system efficiency
- Improving product yield
- Improving dft coverage cost yield
- Porting product to new process
- Ensuring chip on-quality delivery
- Reducing power consumption
- Customer mass production issues
- Meeting sales targets
▲Active Projects
- Camera performance optimization
- Wcn ip verification
- Ate test program development
- Chip bringup testing
- Hr system optimization
- Process construction and implementation
- R&d project roi model improvement
- Dft design planning
- Software revenue sharing model
- Rf transceiver module design
Hiring Activity
500 roles · 290 in 30d
Department
Seniority
Notable leadership hires: Product Director, Digital IP Director, Sales Director, IP Department Head, HR Director
Company intelligence
