Multi-node foundry for analog and mixed-signal semiconductor manufacturing
Tower Semiconductor operates a global foundry network (Israel, U.S., Japan, Italy, and U.S. via Intel partnership) focused on analog, power-management, and sensor IC production for 300+ customers. Engineering and manufacturing staff dominate the hiring mix, with active focus on dry-etch capability development, process-technology ramp, and equipment reliability — signals of capacity expansion and yield optimization work across their wafer nodes.
Notable leadership hires: Category Director, Global Category Director, Operational Excellence Director
Tower Semiconductor is a public foundry (NASDAQ: TSEM) specializing in analog and mixed-signal IC manufacturing. The company operates or co-owns five wafer fabrication facilities: one 200mm fab in Israel, two 200mm fabs in the U.S., a 51%-owned stake in two Japanese fabs (200mm and 300mm), a shared 300mm facility in Italy with STMicroelectronics, and access to Intel's 300mm capacity in New Mexico. Core process nodes include SiGe BiCMOS, RF CMOS, power management, CMOS image sensors, non-imaging sensors, and MEMS, with design enablement and process-transfer services for IDM and fabless partners. The customer base spans automotive, medical, industrial, IoT, aerospace & defense, and consumer segments.
Five facilities: 200mm fab in Israel, two 200mm fabs in U.S., two Japanese fabs (200mm and 300mm) via 51% ownership in TPSCo, shared 300mm in Italy with STMicroelectronics, and access to Intel's 300mm capacity in New Mexico.
Analog ICs, power management, RF CMOS, SiGe BiCMOS, CMOS image sensors, non-imaging sensors, MEMS, and mixed-signal CMOS. Serves 300+ customers in automotive, medical, industrial, IoT, aerospace & defense, and consumer markets.
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