深圳市富满电子 designs and manufactures power management and USB Power Delivery ICs. The engineering-heavy org (15 of 18 headcount) paired with active projects spanning chip layout, tapeout, protocol implementation, and mass production verification indicates a company moving from design through to volume manufacturing. Tech stack is classic analog/mixed-signal: Cadence Virtuoso, Verilog, ModelSim, UVM for simulation, plus layout tools (Calibre, Altium Designer) — typical for semiconductor design firms targeting production at scale.
深圳市富满电子 operates as a semiconductor design and manufacturing company headquartered in Shenzhen, Guangdong Province, China. The firm focuses on power management ICs and USB Power Delivery protocol chips for consumer and industrial applications. With a nine-person core team, the company maintains a vertically integrated operation spanning silicon design (schematic → layout → tapeout), design verification, demo board development, and manufacturing introduction. Active workstreams cover new product development, market strategy, and production ramp — all underpinned by cost control and quality assurance.
Cadence (Virtuoso), Calibre, Verilog, ModelSim, UVM, Altium Designer for layout and simulation; C and Assembly for firmware; Linux/bash/Tcl for automation.
USB Power Delivery protocol ICs, power management ICs (including IGBT and BMS integration), with active projects in chip tapeout, demo boards, and mass production verification.
China only. Current open roles total 18 across engineering (15), sales (2), and manufacturing (1), weighted toward mid-level and director-level engineering positions.
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