Electronic interconnect manufacturer for high-speed and rugged applications
Samtec manufactures electronic connectors and cable assemblies for data-center, telecom, and industrial applications. The company operates a vertically integrated model spanning design (SolidWorks, Cadence, Ansys), manufacturing (FANUC automation), and quality control (Minitab, JMP, Six Sigma). Hiring is heavily weighted toward engineering and manufacturing roles across 12 countries, with active project focus on new product development, tooling, and supplier onboarding—reflecting pressure to reduce production costs and manage tight development cycles while maintaining quality metrics.
Samtec is a privately held connector manufacturer founded in 1976, headquartered in New Albany, Indiana. The company serves customers in over 125 countries and reported revenues exceeding $1 billion in 2022. Their product portfolio spans micro connectors, rugged board-to-board and cable-to-board solutions, custom cable assemblies, and high-speed interconnects up to 112 Gbps. Operations are fully integrated across design, manufacturing, and logistics, with manufacturing footprint in the United States, Mexico, Asia-Pacific, Europe, and United Kingdom. The organization maintains an engineering-heavy workforce aligned to ongoing product innovation and manufacturing optimization.
Design tools include SolidWorks, Cadence Allegro, Ansys HFSS/SIwave, and Keysight ADS. Manufacturing uses FANUC automation and LabVIEW control. Quality and process engineering rely on Minitab, JMP, Six Sigma, and MATLAB. Data infrastructure includes SQL Server, MongoDB, and DynamoDB.
Samtec actively recruits across 12 countries: United States, Malaysia, Taiwan, Japan, South Korea, Vietnam, Germany, China, Costa Rica, Singapore, United Kingdom, and India. Engineering and manufacturing roles represent 85% of current open positions.
Active projects center on new product development, connector solutions design, tooling and assembly processes, supplier evaluation, materials innovation, and product testing of new plating technologies. Development timelines remain tight, with focus on reducing production costs and improving on-time delivery.
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