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Rapidus Corporation Tech Stack

Advanced logic semiconductor manufacturing with 2nm and 3D packaging focus

Semiconductor Manufacturing 千代田区, 東京都 501–1,000 employees Privately Held

Rapidus operates a logic semiconductor fab in Japan with active R&D pipelines in 2nm nodes and fan-out 3D packaging. The stack spans IBM process tech, Cadence/Synopsys design tools, MES/SCADA production control, and emerging SPC-based predictive quality systems — a mix reflecting both legacy fab operations and emerging data-driven yield management. Engineering and quality dominate hiring, while internal pain points cluster around yield improvement and equipment connectivity, suggesting the company is scaling manufacturing throughput amid tighter process nodes.

Tech Stack 27 technologies

Core StackJava Python JavaScript PHP Node.js MLflow IBM FIB-SEM PLC MES SCADA SQL Excel Word PowerPoint Cadence Synopsys Spotfire JMP SPC HTML CSS CMOS AutoML

What Rapidus Corporation Is Building

Challenges

  • Yield improvement
  • Automating maintenance processes
  • Productivity improvement
  • Inventory adjustment
  • 生産性改善
  • 歩留改善
  • コストダウン
  • Equipment online connectivity
  • Integration with production equipment
  • Stable supply chain

Active Projects

  • 2nm advanced logic development
  • Fan-out 2.5d 3d packaging technology development
  • Spc-based predictive management
  • Wafer defect inspection
  • Internal quality system development
  • Domestic plant start-up
  • Employee engagement improvement initiative
  • 国内工場立ち上げ
  • 超tatライン開発
  • Silicon interposer manufacturing technology development

Hiring Activity

Minimal40 roles · 3 in 30d

Department

Engineering
17
Quality
7
Manufacturing
4
Finance
3
HR
3
Legal
2
Executive
1
Marketing
1

Seniority

Mid
22
Senior
9
Manager
8
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About Rapidus Corporation

Rapidus is a logic semiconductor manufacturer headquartered in Tokyo, Japan, with 501–1,000 employees. The company develops and manufactures advanced logic integrated circuits and semiconductor devices, with active focus areas including 2nm process technology and fan-out 2.5D/3D packaging. Organizational structure reflects fab operations: engineering, quality, and manufacturing roles form the core, supported by finance, HR, legal, and marketing functions. Active hiring spans both Japan and the United States. Key internal initiatives include wafer defect inspection automation, predictive maintenance processes, and domestic plant startup activities.

Headquarters千代田区, 東京都
Company Size501–1,000 employees
Hiring MarketsJapan, United States

Frequently Asked Questions

What advanced process nodes is Rapidus developing?

Active development on 2nm advanced logic nodes and fan-out 2.5D/3D packaging technology. Also working on silicon interposer manufacturing and related next-generation packaging architectures.

What software does Rapidus use in manufacturing?

Production control via MES and SCADA systems; design tools include Cadence and Synopsys; quality analytics via JMP and Spotfire; emerging adoption of SPC-based predictive management and MLflow for process optimization.

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