Power Integrations manufactures specialized semiconductors for AC-DC power supplies and high-power industrial systems. The stack reveals a manufacturing-first organization: LTspice, Altium, SystemVerilog, and UVM for chip design; Teradyne and TestStand for test automation; Oracle, SAP IBP, and Kinaxis for supply-chain planning. Active hiring is engineering-heavy (32 roles), with concentrated focus on NPI, yield improvement, and Oracle process overhaul—indicating operational scaling tied to new product ramps and internal systems modernization.
Notable leadership hires: Rewards Director
Power Integrations designs integrated circuits and diodes for power-conversion applications across consumer electronics (mobile, TV, PC, appliances, LED lighting) and industrial systems (motor drives, solar/wind inverters, electric vehicles, HVDC transmission). The company operates a capital-intensive semiconductor business spanning design, test, and manufacturing coordination across Malaysia, India, Mexico, Philippines, and the United States. Current operational priorities center on NPI support, supply-chain risk reduction, assembly yield improvement, and Oracle system optimization—typical of a maturing fab-lite supplier managing both internal process capability and external manufacturing partnerships.
Design and simulation: LTspice, Altium, SystemVerilog, UVM, MATLAB, C++. Test and production: Teradyne, TestStand, LabVIEW. ERP and supply-chain: Oracle, SAP IBP, Kinaxis, Blue Yonder, Workday. Core semiconductor IP: IGBT drivers, SiC MOSFETs, FPGA-based test solutions.
New product introduction (NPI) support, cost accounting and Oracle process improvements, yield enhancement in final test and assembly, supply-chain diversification for OSAT suppliers, automation of reconciliation and lot-tracking processes, and M&A integration activities.
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