L
LIGENTEC Tech Stack
Photonic integrated circuit manufacturer for quantum, LiDAR, and communication systems
LIGENTEC manufactures photonic integrated circuits (PICs) using all-nitride-core technology for quantum, LiDAR, AI, and telecom applications. The company is engineering-heavy with accelerating hiring (8 roles posted in the last 30 days, mostly senior engineers), focused on scaling prototype fabrication, process yield, and reducing design cycle time—a pattern typical of deep-tech hardware firms transitioning from R&D prototypes to production readiness. Active adoption of silicon photonics signals expansion beyond their core nitride platform.
Tech Stack 11 technologies
AdoptingSilicon Photonics
What LIGENTEC Is Building
◆Challenges
- Reducing design/layout cycle time
- Accelerating market entry
- Increasing process maturity
- Scaling test operations
- Improving yield and reducing defects
- Process maturity transition
- Identifying bottlenecks in design flow
- Identifying funding opportunities
- Scaling prototype fabrication runs
- Process automation
▲Active Projects
- Active material integration on sin platform
- Prototype fabrication run scaling
- Proof of concept pic design studies and pic layouts
- Process improvement projects to improve yield and reduce defects
- Statistical process control data collection
- New equipment/process validation
- Pic design and layout projects
- R&d testing campaigns
- Automated testing tools development
- Transitioning technology to products
Hiring Activity
15 roles · 8 in 30d
Department
Seniority
Company intelligence
