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成都市晶林科技有限公司 Tech Stack

Embedded systems and chip design for industrial sensing

成都, 四川

成都市晶林科技 develops SoC and FPGA solutions for thermal imaging and monitoring systems. The stack—AutoCAD, Allegro, Keil, Quartus, ARM, RISC-V—reflects hardware-centric product work spanning chip ROM development, FPGA prototyping, and PCB design. Active hiring is minimal (no roles posted in 30 days) and concentrated in engineering; cost optimization in PCB design and layer planning suggest they're refining manufacturability rather than expanding scope.

Tech Stack 19 technologies

Core StackAutoCAD Linux Python Visual Studio SolidWorks Allegro C ARM RISC-V Keil Quartus Bash FPGA C/C++ Buildroot Source Insight Altium Designer CAD Pro/ENGINEER

What 成都市晶林科技有限公司 Is Building

◆Challenges

Cost saving in pcb design
Efficient pcb layer planning

▲Active Projects

Soc chip rom code development
Fpga prototype verification platform
Chip application solution development
Infrared thermal imaging instrument design
Online monitoring system design

Hiring Activity

Minimal9 roles · 0 in 30d

Department

Engineering

Sales

Support

Seniority

Mid

Junior

Manager

Senior

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About 成都市晶林科技有限公司

成都市晶林科技, based in Chengdu, Sichuan, designs embedded systems and semiconductor solutions for industrial applications. Current product focus spans SoC chip development (ROM code), FPGA prototype platforms, and thermal imaging instruments. The company also delivers application-level solutions and online monitoring systems. Engineering dominates the active team, supported by a small sales and support function. Hiring remains selective, concentrated in China.

Headquarters成都, 四川

Hiring MarketsChina

Frequently Asked Questions

What embedded design tools does 成都市晶林科技 use?

Primary tools include AutoCAD and Allegro for PCB design, Keil and Quartus for microcontroller and FPGA development, plus C/C++, ARM, and RISC-V for firmware and SoC work. CAD packages include SolidWorks and Pro/ENGINEER.

What is 成都市晶林科技 working on?

Current projects include SoC chip ROM code development, FPGA prototype verification platforms, thermal imaging instrument design, chip application solutions, and online monitoring systems. PCB cost optimization and layer planning are priority engineering challenges.