杭

杭州铁城信息科技有限公司 Tech Stack

EV charging hardware design and power supply engineering

Appliances, Electrical, and Electronics Manufacturing 杭州市, 浙江省 ~22 employees

Tiecheng designs high-power charging modules and power supplies for electric vehicles, with a hardware-focused engineering team building around embedded systems (ARM, DSP, CAN bus, Ethernet) and CAD tools (Altium Designer, AutoCAD). The org is almost entirely engineering-driven (7 of 8 open roles) with a senior-heavy seniority mix, reflecting the complexity of EV charger design — a space where EMC compliance and thermal management are critical, non-negotiable constraints.

Tech Stack 12 technologies

Core StackAutoCAD C++ Altium Designer C DSP ARM CAN bus UART I2C Ethernet WiFi Assembly

What 杭州铁城信息科技有限公司 Is Building

◆Challenges

Designing high-power charging modules
Ensuring emc compliance
Developing power supply for ev chargers
Accounts receivable collection

▲Active Projects

New energy vehicle charging module design

Hiring Activity

Minimal8 roles · 0 in 30d

Department

Engineering

7

Sales

1

Seniority

Senior

4

Mid

2

Junior

1

Manager

1

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About 杭州铁城信息科技有限公司

Tiecheng is a hardware design firm based in Hangzhou, China, specializing in power electronics and charging infrastructure for the electric vehicle sector. The company focuses on designing high-power charging modules and power supply systems, working through the full stack of embedded systems (ARM processors, DSP chips, CAN/UART/I2C protocols) and leveraging professional-grade design tools like Altium Designer and AutoCAD. With 22 employees, the team is concentrated in engineering, suggesting a product-development-first operating model. Current challenges span both technical (EMC compliance, thermal management in high-power designs) and operational (accounts receivable collection).

Headquarters杭州市, 浙江省

Company Size~22 employees

Hiring MarketsChina

Frequently Asked Questions

What is Tiecheng's tech stack?

Altium Designer and AutoCAD for PCB/mechanical design; ARM and DSP for embedded compute; CAN bus, UART, I2C, Ethernet, and WiFi for communications; C and C++ for firmware; Assembly for low-level optimization.