Ultra-low power semiconductor design and manufacturing for battery and field-powered devices
EM Microelectronic designs and manufactures ultra-low power analog and mixed-signal ICs for battery-operated and energy-harvesting applications across consumer, automotive, and industrial markets. The engineering-heavy hiring mix—concentrated in design and manufacturing roles across manager, senior, and mid levels—reflects an organization scaling production capacity and product complexity simultaneously. Active projects span functional model development, next-generation sensing and imaging ASICs, and process qualification, while documented pain points (yield excursions, parametric drift, equipment matching, test cost reduction) signal the operational friction typical of high-volume analog fabs operating near physical limits.
EM Microelectronic is a semiconductor manufacturer headquartered in Marin, Switzerland, and majority-owned by The Swatch Group since 1985. The company specializes in ultra-low power integrated circuits—Bluetooth Low Energy, RFID, power management, LCD drivers, sensor and optoelectronic ICs, and custom mixed-signal ASICs—designed for applications where battery life and power consumption are critical constraints. The portfolio serves consumer electronics, access control and logistics (RFID), automotive, industrial automation, and communications markets. EM operates its own fabrication facility alongside external foundry partnerships, employing 501–1,000 people with active engineering, manufacturing, and operations teams. The bulk of current revenue derives from non-watch applications, reflecting diversification beyond the company's historical consumer electronics roots.
EM specializes in ultra-low power and low-voltage integrated circuits: Bluetooth Low Energy, RFID, power management ICs, LCD drivers, sensor and optoelectronic ICs, microcontrollers, mixed-signal ASICs, and smartcard ICs, targeting battery-operated and field-powered devices.
Active projects include next-generation custom ICs for sensing and imaging, functional model development, process qualification for volume production, yield improvement, parametric test enhancement, new equipment commissioning, and product launch execution.
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