Composable semiconductor and infrastructure systems for tiered data centers
Elastics.cloud designs semiconductor and firmware systems targeting distributed data center architectures. The stack is deeply hardware-focused—Verilog, SystemVerilog, ASIC, PCIe, NVMe, and EDA tools (Innovus, Calibre, HFSS)—with embedded Linux and firmware layers (UEFI, BIOS, Trusted Firmware). Active projects span ASIC delivery, post-silicon validation, and rapid prototyping, while timing closure and low-power implementation remain active challenges. The hiring mix (7 senior, 3 leads, all engineering) suggests a small, specialized team focused on architecture and design rather than scaling production.
Elastics.cloud is a semiconductor and systems company founded in 2020, based in Santa Clara. They target the $800 billion infrastructure market—on-prem, edge, and core data center equipment—with a focus on composable architectures that improve component utilization and reduce total cost of ownership in heterogeneous workload environments. Their work centers on hardware-software integration: low-latency processing systems that address tiered data center requirements. The company employs 51–200 people, primarily in engineering roles across the United States and India.
Hardware design languages (Verilog, SystemVerilog, VHDL), ASIC and FPGA tooling (Xilinx, Innovus, Calibre), PCIe and NVMe standards, embedded firmware (Linux Kernel, UEFI, BIOS, Trusted Firmware), and EDA software (Allegro, HFSS, SerDes). Development in C, C++, Python, and Perl.
ASIC and SoC integration, post-silicon system validation, firmware delivery and integration, and rapid prototyping of new product concepts. Current technical challenges include timing closure and low-power implementation.
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