Optical inspection and 3D metrology for advanced semiconductor wafers
Confovis manufactures automated optical inspection (AOI) and 3D surface metrology systems for semiconductor fabs, with a focus on wide-bandgap materials like SiC, GaAs, and GaN. The engineering-focused hiring (8 of 15 active roles) and project backlog—image processing algorithms, GPU/FPGA platform evaluation, speed optimization—reveal active development on inspection algorithms and hardware acceleration, suggesting a push toward faster defect detection in production environments where cycle time is critical.
Confovis develops and manufactures optical inspection and metrology instruments for semiconductor and MEMS production. Their systems perform automated defect inspection, classification, and dimensional measurement, particularly for surface topography in statistical process control. The platform differentiates on flexibility: defect recipes and classifications are configurable via a GUI with rule-based AI training, reducing setup friction compared to fixed inspection logic. Founded in 2009 and based in Jena, Germany, the company serves semiconductor fabs, surface-technology operations, and automotive/aerospace manufacturers.
Confovis manufactures automated optical inspection (AOI) and 3D metrology instruments for semiconductor fabs. Their systems detect, classify, and measure defects on wafers, with particular focus on wide-bandgap materials like SiC, GaAs, and GaN.
Core stack includes Beckhoff (industrial control), EPLAN Electric P8 (electrical design), SolidWorks + PDM (mechanical CAD), and software languages Python, MATLAB, C#, Java, and C++. Currently evaluating GPU/FPGA platforms for speed-critical image processing.
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