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合肥芯荣微电子有限公司 Tech Stack

Semiconductor packaging and MEMS manufacturing in China

合肥, 安徽 ~3 employees
chipmotion.com LinkedIn

芯荣微电子is a small semiconductor and MEMS manufacturer based in Hefei, with an engineering-dominant org (36 of 50 headcount in engineering) focused on discrete device and module packaging. The stack reveals a mature manufacturing operation — ANSYS, COMSOL, HFSS for simulation; Nikon and photolithography for process control; MES and ERP for production; FMEA, SPC, MSA for quality — paired with active work on MES implementation and yield optimization, suggesting operational scaling rather than product innovation.

Tech Stack 23 technologies

Core StackC# Java .NET Oracle Database AutoCAD ANSYS COMSOL Nikon Word Excel FMEA SPC MSA Six Sigma MES ERP HFSS VBA Photolithography ISO 14001 ISO 45001 IATF 16949 MEMS

What 合肥芯荣微电子有限公司 Is Building

◆Challenges

  • Solving packaging quality issues
  • Yield improvement
  • Improving test system performance
  • Reducing production costs
  • Reducing process anomaly rate
  • Equipment maintenance
  • Ensuring process stability
  • Process bottlenecks
  • Improving equipment utilization
  • Improving product yield

▲Active Projects

  • Discrete and module packaging process development
  • New product mass production
  • Supplier equipment evaluation
  • Specification file development
  • Mes implementation
  • Mes system improvement
  • Production system development
  • New process and equipment introduction and verification
  • Fire system annual testing project
  • New filter product design

Hiring Activity

Minimal50 roles · 0 in 30d

Department

Engineering
36
Manufacturing
5
Sales
4
Ops
2
Legal
1

Seniority

Mid
22
Senior
16
Manager
5
Junior
4
Director
1
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About 合肥芯荣微电子有限公司

芯荣微电子manufactures semiconductor packages and MEMS devices for industrial and consumer applications in China. The company operates a vertically integrated production facility with capabilities spanning discrete and modular packaging, process development, and equipment integration. Current focus areas include yield improvement, packaging quality resolution, test system performance, and production cost reduction. The active project list — MES system deployment, new product mass production ramp, supplier equipment evaluation, process verification — reflects a company in transition from small-batch to scaled manufacturing.

Headquarters合肥, 安徽
Company Size~3 employees
Hiring MarketsChina

Frequently Asked Questions

What manufacturing tools does 芯荣微电子 use?

The stack includes ANSYS and COMSOL for simulation, Nikon for lithography, HFSS for electromagnetic modeling, AutoCAD for design, plus MES and ERP systems for production control and quality frameworks (FMEA, SPC, MSA, Six Sigma).

What is 芯荣微电子 working on?

Active projects include discrete and module packaging process development, new product mass production, MES system implementation and improvement, supplier equipment evaluation, and process verification for new manufacturing equipment.