AT&S is a 13,000-person public manufacturer of printed circuit boards and integrated-circuit substrates, operating production facilities across Austria, China, Malaysia, and India. The engineering-focused hiring mix (60 roles) combined with active projects around HVM yield improvement, process standardization, and new material qualification signals a company scaling manufacturing complexity at the high end of the semiconductor supply chain — moving beyond commodity PCBs into advanced substrates for AI and automotive applications.
AT&S manufactures high-end interconnect technologies and IC substrates for mobile devices, automotive, aerospace, industrial, medical, and high-performance computing markets. The company operates production sites in Austria (Leoben, Fehring), China (Shanghai, Chongqing), Malaysia (Kulim), and India (Nanjangud), with Leoben serving as the European R&D and substrate competence center. Founded in 1987 and publicly traded, AT&S employs approximately 13,000 people globally and competes in a capital-intensive business where process control, yield optimization, and compliance with automotive/aerospace standards (TS16949, ISO 14001) are core operational drivers.
Austria (Leoben, Fehring), China (Shanghai, Chongqing), Malaysia (Kulim), and India (Nanjangud). Leoben also serves as the European R&D and IC substrate production hub.
Current projects include HVM yield improvement, new material qualification for back-end processes, process standardization, TS16949/ISO 14001 implementation, equipment procurement, and new product introduction — reflecting focus on manufacturing scale and compliance.
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